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알루미늄 박막의 금속 유기 화합물 화학증착법에 의한 평탄화 금속 배선 개발에 관한 연구 : A Study on the development of planarized metalization by metalorganic chemical vapor deposition of aluminum thin films

DC Field Value Language
dc.contributor.advisor주승기-
dc.contributor.author김병윤-
dc.date.accessioned2010-02-05T06:43:40Z-
dc.date.available2010-02-05T06:43:40Z-
dc.date.copyright1997.-
dc.date.issued1997-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000079017kog
dc.identifier.urihttps://hdl.handle.net/10371/50859-
dc.description학위논문(박사)--서울대학교 대학원 :금속공학과,1997.ko
dc.format.extentxi, 101 장ko
dc.language.isokoko
dc.publisher서울대학교 대학원ko
dc.subjectplasmako
dc.subject플라즈마ko
dc.subjectCVDko
dc.subject화학증착ko
dc.subjectaluminumko
dc.subject알루미늄ko
dc.subjectDMEAAko
dc.subject초고집적회로ko
dc.subjectULSIko
dc.subject금속선ko
dc.title알루미늄 박막의 금속 유기 화합물 화학증착법에 의한 평탄화 금속 배선 개발에 관한 연구ko
dc.title.alternativeA Study on the development of planarized metalization by metalorganic chemical vapor deposition of aluminum thin filmsko
dc.typeThesis-
dc.contributor.department금속공학과-
dc.description.degreeDoctorko
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