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저온 동시 소결 세라믹 (LTCC) 기판과 금-주석 공융 접합층을 이용한 RF MEMS 소자의 실장에 대한 연구
(A)study on LTCC-based RF MEMS package using gold-tin eutectic bonding

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Authors
방용승
Advisor
김용권
Issue Date
2007
Publisher
서울대학교 대학원
Keywords
LTCCLTCC금-주석gold-tin공융접합eutectic bondingRF MEMSpackage실장vertical feedthrough수직신호연결hermeticity밀봉도
Description
학위논문(석사) --서울대학교 대학원 :전기. 컴퓨터공학부,2007.
Language
English
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000043902

https://hdl.handle.net/10371/52511
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Theses (Master's Degree_전기·정보공학부)
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