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Interfacial study of polyimide/copper system using silane-modified polyvinylimidazoles as adhesion promoters
Cited 18 time in
Web of Science
Cited 17 time in Scopus
- Authors
- Issue Date
- 2001
- Publisher
- Elsevier
- Citation
- Polymer 2001;42:2871-2876
- Abstract
- Polyvinylimidazoles(PVIs) modi®ed with vinyltrimethoxysilane (VTS) in different mole ratios were applied as adhesion promoters for
polyimide (PI)/copper interface. The effects of the composition of VTS-modi®ed PVI copolymers on lap shear strengths between PI and
copper were investigated at different bonding temperatures. Fourier transform infrared spectroscopy was applied to examine the thermooxidative
degradation of PI and oxidation of copper. In addition, scanning electron microscope and contact angle measurement analysis were
performed to investigate the compatibility of VTS-modi®ed PVIs with PI. An improvement in interfacial adhesion strength was obtained
using the adhesion promoters. Especially at higher bonding temperatures, a signi®cant increment in lap shear strength was seen when the
mole ratio (VI:VTS) was 3:7, due to the high thermal stability of the silane unit. However, at lower bonding temperatures, lap shear strength
does not increase as above, owing to the poor compatibility between the VTS-modi®ed PVI with PI. q 2001 Elsevier Science Ltd. All rights
reserved.
- ISSN
- 0032-3861
- Language
- English
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