Browse

Interfacial study of polyimide/copper system using silane-modified polyvinylimidazoles as adhesion promoters

Cited 18 time in Web of Science Cited 17 time in Scopus
Authors
Jang, J; Earmme, T
Issue Date
2001
Publisher
Elsevier
Citation
Polymer 2001;42:2871-2876
Keywords
Polyimide-on-copperSilane-modi®ed polyvinylimidazoleAdhesion promotion
Abstract
Polyvinylimidazoles(PVIs) modi®ed with vinyltrimethoxysilane (VTS) in different mole ratios were applied as adhesion promoters for
polyimide (PI)/copper interface. The effects of the composition of VTS-modi®ed PVI copolymers on lap shear strengths between PI and
copper were investigated at different bonding temperatures. Fourier transform infrared spectroscopy was applied to examine the thermooxidative
degradation of PI and oxidation of copper. In addition, scanning electron microscope and contact angle measurement analysis were
performed to investigate the compatibility of VTS-modi®ed PVIs with PI. An improvement in interfacial adhesion strength was obtained
using the adhesion promoters. Especially at higher bonding temperatures, a signi®cant increment in lap shear strength was seen when the
mole ratio (VI:VTS) was 3:7, due to the high thermal stability of the silane unit. However, at lower bonding temperatures, lap shear strength
does not increase as above, owing to the poor compatibility between the VTS-modi®ed PVI with PI. q 2001 Elsevier Science Ltd. All rights
reserved.
ISSN
0032-3861
Language
English
URI
https://hdl.handle.net/10371/62028
DOI
https://doi.org/10.1016/S0032-3861(00)00701-1
Files in This Item:
There are no files associated with this item.
Appears in Collections:
Student's Archives (학생저작물)Student's WorksGraduated, Researcher (석·박사, 연구생)
  • mendeley

Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.

Browse