S-Space College of Engineering/Engineering Practice School (공과대학/대학원) Dept. of Mechanical Aerospace Engineering (기계항공공학부) Journal Papers (저널논문_기계항공공학부)
Microstructures of poly (ethylene glycol) by molding and dewetting
- Suh, Kahp Y.; Lee, Hong H.
- Issue Date
- American Institute of Physics
- Appl. Phys. Lett. 83, 1668 (2003)
- We report on the fabrication of microstructures of poly (ethylene glycol) (PEG) using a soft molding technique. When a patterned poly (dimethylsiloxane) stamp is placed on a wet PEG film, the polymer in contact with the stamp spontaneously moves into the void space as a result of capillary action. Three types of microstructures are observed with the substrate surface completely exposed: a negative replica of the stamp, a two-dimensional projection of the simple cubic structure, and a two-dimensional projection of the diamond structure. A molding process is responsible for the first type and a dewetting process for the final two. A phase diagram is constructed based on the effects of molecular weight and concentration, which shows that mobility and confinement play a crucial role in determining the particular type of microstructure obtained. The PEG microstructure could be used as a lithographic resist in fabricating electronic devices and a resistant layer for preventing nonspecific adsorption of proteins or cells.