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Elastic Moduli of Organic Electronic Materials by Buckling Method : 좌굴 방법을 이용한 유기 전자 재료의 탄성 계수 연구

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dc.contributor.advisor신규순-
dc.contributor.author탁동하-
dc.date.accessioned2010-05-07T02:13:31Z-
dc.date.available2010-05-07T02:13:31Z-
dc.date.copyright2010-
dc.date.issued2010-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000033552eng
dc.identifier.urihttps://hdl.handle.net/10371/64676-
dc.descriptionThesis(masters) --서울대학교 대학원 :화학생물공학부,2010.2.en
dc.format.extentvii, 45 leavesen
dc.language.isoenen
dc.publisher서울대학교 대학원en
dc.subject좌굴en
dc.subjectWrinkleen
dc.subject기계적 강도en
dc.subjectBucklingen
dc.subject탄성 계수en
dc.subjectMechanical Propertyen
dc.subject체적 탄성률en
dc.subjectElastic Modulusen
dc.subject계측학en
dc.subjectBulk Modulusen
dc.subject프와송 비en
dc.subjectMetrologyen
dc.subject복합 이론en
dc.subjectCompress Strainen
dc.subject유기 전자 재료en
dc.subjectPoisson Ratioen
dc.subject태양 전지.en
dc.subjectComposite Theory.en
dc.titleElastic Moduli of Organic Electronic Materials by Buckling Methoden
dc.title.alternative좌굴 방법을 이용한 유기 전자 재료의 탄성 계수 연구en
dc.typeThesis-
dc.contributor.department화학생물공학부-
dc.description.degreeMasteren
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