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Debonding of <100> symmetric tilt copper grain boundary under tensile loading using molecular dynamics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 조맹효 | - |
| dc.contributor.author | Nguyen, Thao | - |
| dc.date.accessioned | 2010-05-10T03:47:11Z | - |
| dc.date.available | 2010-05-10T03:47:11Z | - |
| dc.date.copyright | 2010 | - |
| dc.date.issued | 2010 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000033395 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/64829 | - |
| dc.description | Thesis(masters) --서울대학교 대학원 :기계항공공학부,2010.2. | en |
| dc.format.extent | 31 leaves | en |
| dc.language.iso | en | en |
| dc.publisher | 서울대학교 대학원 | en |
| dc.subject | Interface model | en |
| dc.subject | Interface model | en |
| dc.subject | Copper | en |
| dc.subject | Copper | en |
| dc.subject | FCC | en |
| dc.subject | FCC | en |
| dc.subject | Cohesive zone | en |
| dc.subject | Cohesive zone | en |
| dc.title | Debonding of <100> symmetric tilt copper grain boundary under tensile loading using molecular dynamics | en |
| dc.type | Thesis | - |
| dc.contributor.department | 기계항공공학부 | - |
| dc.description.degree | Master | en |
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