Characteristics of novel dental composites containing 2,2-bis[4-(2-methoxy-3-methacryloyloxy propoxy) phenyl] propane as a base resin.

Cited 49 time in Web of Science Cited 53 time in Scopus

Kim, J. W.; Kim, L. U.; Kim, C. K.; Cho, B. H.; Kim, O. Y.

Issue Date
American Chemical Society
Biomacromolecules 2006, 7, 154-160
Many dental restorative dental composites still utilize 2,2-bis[4-(2-hydroxy-3-methacryloyloxy propoxy) phenyl]
propane (Bis-GMA) as base resin. The high viscosity of Bis-GMA necessitates dilution with dimethacrylate ethers
of low viscosity such as triethylene glycol dimethacrylate (TEGDMA). However, increased amounts of the
TEGDMA have adverse effects on properties such as water uptake and curing shrinkage. The viscosity of the
base resin should be as low as possible to enable the preparation of dental composites with a minimum content
of diluent. To overcome the disadvantage of Bis-GMA, i.e., its high viscosity caused by hydrogen bonding between
hydroxyl groups, 2,2-bis[4-(2-methoxy-3-methacryloyloxy propoxy) phenyl propane (Bis-M-GMA) was prepared
by substituting methoxy groups for hydroxyl groups in Bis-GMA. The viscosity of Bis-GMA was dramatically
decreased from 574 (Pa.s) to 3.7 (Pa.s) by substitution of methoxy group. Consequently, the amount of TEGDMA
included in the resin matrix could be minimized. Dental composites were prepared from Bis-M-GMA (or Bis-
GMA) mixtures with TEGDMA filled with 75 wt % filler. Comparing the curing shrinkage of dental composite
containing Bis-M-GMA with that prepared from Bis-GMA, the reduction in curing shrinkage was about 47%.
Dental composites prepared from new resin matrixes also exhibited low water uptake and better properties in
mechanical strength.
Files in This Item:
There are no files associated with this item.
Appears in Collections:
College of Dentistry/School of Dentistry (치과대학/치의학대학원)Dept. of Dentistry (치의학과)Journal Papers (저널논문_치의학과)
  • mendeley

Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.