S-Space College of Dentistry/School of Dentistry (치과대학/치의학대학원) Dept. of Dentistry (치의학과) Journal Papers (저널논문_치의학과)
Effect of light-cure time of adhesive resin on the thickness of the oxygen inhibited layer and the micro-tensile bond strength to dentine.
- Kim, Jong-Soon; Choi, Yong-Hoon; Cho, Byeong-Hoon; Son, Ho-Hyun; Lee, In-Bog; Um, Chung-Moon; Kim, Chang-Keun
- Issue Date
- Journal of Biomedical Materials Research Part B 2006;78B:115-123
- dentin adhesive; oxygen-inhibited layer; microtensile bond strength; crack mechanism; FT-NIR
- A thick oxygen-inhibited layer (OIL) on a cured adhesive layer (AL) is believed to result in both good adaptation of composite resin (CR) and high bond strength. A high degree of conversion (DC) of the AL is also needed for durable bonding. This study evaluated the hypothesis that increasing the DC by prolonging the light-curing time of adhesive bonding resin might decrease the bond strength of the adhesive to dentin because of the subsequent thinning of the OIL thickness. The OIL thickness and the DC of solvent-removed One Step and D/E bonding resin of All Bond 2 (Bisco, USA) were measured simultaneously with FT-NIR spectroscopy according to increasing light-cure times (10, 20, 30, and 60 s) so as to evaluate their effect on the microtensile bond strength. The bonded interfaces were evaluated using scanning electron microscopy. Excessive irradiation of light-curing adhesives increased the DC, but decreased the OIL thickness. When the OIL was significantly thin by curing the adhesives for 30 or 60 s, defects were observed at the interface between the AL and the CR, as well as at the interface between the AL and the hybrid layer. When the OIL was thick, free radicals from the overlying CR may have diffused into the unreacted monomer mixtures of the OIL, chemically connecting the cured AL and the newly curing composite. It was found that to obtain maximum dentin bond strength, light-curing adhesives should be cured for the irradiation time recommended by the manufacturer. © 2005 Wiley Periodicals, Inc. J Biomed Mater Res Part B: Appl Biomater, 2006
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