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Blister Test를 이용한 폴리이미드 신경 전극의 안정성 평가
Application of the Blister Test to Assess Reliability of Polymide Based Microelectrode Arrays

DC Field Value Language
dc.contributor.author이승우-
dc.contributor.author김의태-
dc.contributor.author김성준-
dc.date.accessioned2009-08-27T02:49:40Z-
dc.date.available2009-08-27T02:49:40Z-
dc.date.issued2007-11-09-
dc.identifier.citation제36회 대한의용생체공학회 추계학술대회, 고려대학교, 2007년 11월 9일en
dc.identifier.urihttps://hdl.handle.net/10371/7913-
dc.description.sponsorshipThis study was supported by Korea Science and Engineering Foundation (KOSEF) through Nano Bioelectronics and Systems Research Center (NBS-ERC) in Seoul National University, and by a grant of the Korea Health 21 R&D Project (A050251),Ministry of Health & Welfare, Republic of Korea.en
dc.language.isokoen
dc.publisher대한의용생체공학회 = The Korean Society of Medical & Biological Engineeringen
dc.titleBlister Test를 이용한 폴리이미드 신경 전극의 안정성 평가en
dc.title.alternativeApplication of the Blister Test to Assess Reliability of Polymide Based Microelectrode Arraysen
dc.typeConference Paperen
dc.contributor.AlternativeAuthorLee, S. W.-
dc.contributor.AlternativeAuthorKim, E. T.-
dc.contributor.AlternativeAuthorKim, Sung June-
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Others_전기·정보공학부
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