S-Space

Browse

Subject

Showing results 1 to 2 of 2

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2001	Curing behavior of tetrafunctional epoxy resin/hyperbranched polymer system Oh, Joon Hak; Jang, Jyongsik Polymer 2001;42:8339	DOI
2020-12	Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives Jee, Sung Min; Ahn, Cheol-Hee; Park, Jong Hyuk; Kim, Tae Ann; Park, Min Composites Part B: Engineering, Vol.202, p. 108438	DOI