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Showing results 1 to 4 of 4

Issue Date	Title / Author(s) / Citation	File
2013-05	Crack nucleation during mechanical fatigue in thin metal films on flexible substrates Kim, Byoung Joon; Shin, Hae-A-Seul; Jung, Sung Yup; Cho, Yigil; Kraft, Oliver; Choi, In Suk; Joo, Young Chang Acta Materialia, Vol.61 No.9, pp.3473-3481	DOI
2022-07	Robust Co alloy design for Co interconnects using a self-forming barrier layer Kim, Cheol; Kang, Geosan; Jung, Youngran; Kim, Ji-Yong; Lee, Gi-Baek; Hong, Deokgi; Lee, Yoongu; Hwang, Soon-Gyu; Jung, In-Ho; Joo, Young Chang Scientific Reports, Vol.12 No.1, p. 12291	DOI
2023-04	Copper Bonding Technology in Heterogeneous Integration Lee, Yoon-Gu; McInerney, Michael; Joo, Young Chang; Choi, In Suk; Kim, Sarah Eunkyung Electronic Materials Letters, Vol.20 No.1, pp.1-25	DOI
2024-03	Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects Lee, Seongi; Shin, Jae Myeong; Hyun, Jun Hyeok; Choi, In Suk; Joo, Young Chang; Kim, Byoung Joon; Lee, So Yeon Journal of Materials Research and Technology, Vol.29, pp.851-856	DOI