Publications
Detailed Information
Electrochemical migration behavior of Sn-based solder alloys for electronic packaging : 전자 패키징용 Sn계 솔더 합금의 Electrochemical migration 거동에 관한 연구
Cited 0 time in
Web of Science
Cited 0 time in Scopus
- Authors
- Advisor
- 주영창
- Issue Date
- 2009
- Publisher
- 서울대학교 대학원
- Keywords
- 전기화학 마이그레이션 ; electrochemical migration ; 부식 ; corrosion ; 수지상 필라멘트 ; dendritic filament ; 전도성 양극 필라멘트 ; conductive anodic filament ; 물방울 적하 시험 ; Sn ; 양극 분극 시험 ; SnPb ; 부동태 ; SnAgCu ; 신뢰성 ; water-drop test ; 전자패키징 ; anodic polarization test ; passivity ; reliability ; electronic package
- Description
- Thesis(doctors) --서울대학교 대학원 :재료공학부,2009.8.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000038125
https://hdl.handle.net/10371/12863
- Files in This Item:
- There are no files associated with this item.
Item View & Download Count
Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.