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Analysis of the flow-field during Chemical Mechanical Polishing(CMP) using Particle Image Velocimetry(PIV) : PIV를 이용한 화학적 기계학적 연마공정 중의 연마액 유동 분석
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- Authors
- Advisor
- 윤영빈
- Issue Date
- 2005
- Publisher
- 서울대학교 대학원
- Keywords
- 화학적 기계학적 연마 ; Chemical Mechanical Polishing ; 윤활 ; Particle Image Velocimetry ; 연마액의 속도 분포 ; Velocity distribution of slurry ; PIV ; Slurry film thickness ; 연마액 피막 두께 ; Lubrication
- Description
- Thesis(master`s)--서울대학교 대학원 :기계항공공학부,2005.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000051123
https://hdl.handle.net/10371/44427
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