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Cu 배선공정에서 확산방지막으로서 TiN 박막에 대한 연구 : A Study on the TiN thin film as a diffusion barrier in Cu metallizaition
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- Authors
- Advisor
- 김기범
- Issue Date
- 1998
- Publisher
- 서울대학교 대학원
- Description
- 학위논문(박사)--서울대학교 대학원 :금속공학과,1998.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000076518
https://hdl.handle.net/10371/50832
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