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Microstructures of poly (ethylene glycol) by molding and dewetting

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Authors
Suh, Kahp Y.; Lee, Hong H.
Issue Date
2003-08-25
Publisher
American Institute of Physics
Citation
Appl. Phys. Lett. 83, 1668 (2003)
Keywords
3-DIMENSIONAL MICROSTRUCTURESSOFT LITHOGRAPHYFABRICATIONSURFACESFILMS
Abstract
We report on the fabrication of microstructures of poly (ethylene glycol) (PEG) using a soft molding technique. When a patterned poly (dimethylsiloxane) stamp is placed on a wet PEG film, the polymer in contact with the stamp spontaneously moves into the void space as a result of capillary action. Three types of microstructures are observed with the substrate surface completely exposed: a negative replica of the stamp, a two-dimensional projection of the simple cubic structure, and a two-dimensional projection of the diamond structure. A molding process is responsible for the first type and a dewetting process for the final two. A phase diagram is constructed based on the effects of molecular weight and concentration, which shows that mobility and confinement play a crucial role in determining the particular type of microstructure obtained. The PEG microstructure could be used as a lithographic resist in fabricating electronic devices and a resistant layer for preventing nonspecific adsorption of proteins or cells.
ISSN
0003-6951
Language
English
URI
http://hdl.handle.net/10371/6230
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Mechanical Aerospace Engineering (기계항공공학부)Journal Papers (저널논문_기계항공공학부)
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