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Metal-core printed circuit board with dielectric layer by aerosol deposition process
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- Authors
- Advisor
- 김형준
- Issue Date
- 2010
- Publisher
- 서울대학교 대학원
- Keywords
- 에어로졸 증착법 ; MCPCB(Metal-Core Printed Circuit Board) ; 알루미나 ; Light Emitting Diode(LED) ; 유전층 ; Dielectric layer ; 발광다이오드 ; Aerosol Deposition ; 열저항 ; Al2O3 ; 인쇄회로기판 ; Thermal Resistance
- Description
- Thesis(doctors) --서울대학교 대학원 :재료공학부,2010.2.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000032465
https://hdl.handle.net/10371/63866
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