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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2003-08	Seedless Fill - up of the Damascene Structure Only by Copper Electroless Plating Kim, Jae Jeong; Cha, Seung Hwan; Lee, Young-Soo Japanese Journal of Applied Physics 42(2003) L953-L955	DOI
2004-11	Superconformal Cu Electrodeposition on Various Substrates Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo Electrochemical and Solid-State Letters, 8(1), C19-C21	view file DOI