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Micro-pattern Metallization using Jet-circulating Electrodeposition
제트 순환 전해증착을 이용한 미세 패턴 금속화

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Authors
김한
Advisor
주종남
Major
공과대학 기계항공공학부
Issue Date
2016-08
Publisher
서울대학교 대학원
Keywords
Jet-circulating electrodepositionMetallizationElectroplatingDirect-writingMicro patterning
Description
학위논문 (박사)-- 서울대학교 대학원 : 기계항공공학부, 2016. 8. 주종남.
Abstract
In this dissertation, a novel micro-pattern metallization technique which works via jet-circulating electrodeposition is proposed. The metallization process consists of three steps: electron beam evaporation, jet-circulating electrodeposition, and chemical etching. A copper seed layer for electrodeposition was formed on various materials by electron beam evaporation. Jet-circulating electrodeposition was implemented to fabricate micro-metal patterns on various surfaces, such as glass, plastic and ceramic surfaces. By localizing the circulation of a jetted electrolyte through two concentric nozzles, rapid selective electrodeposition could be performed. A copper pattern with a width of 490 μm and a height of 18.3 μm was fabricated with a 290 μm electrode nozzle.
The conventional electrodeposition technique was applied to jet-circulating electrodeposition to increase deposition quality. Jet electrodeposition technique is applied to increases deposition rate. Pulse-reverse electrodeposition technique also increases deposition rate and decreases surface roughness. Furthermore diverse pulse parameter gives high flexibility to deposition process. The geometry of the copper pattern was investigated by means of scanning electron microscopy (SEM) and with a surface profiler.
Finally, micro-pattern metallization using jet-circulating electrodeposition was performed on diverse substrate materials.
Language
English
URI
https://hdl.handle.net/10371/118554
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Mechanical Aerospace Engineering (기계항공공학부)Theses (Ph.D. / Sc.D._기계항공공학부)
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