Micro-pattern Metallization using Jet-circulating Electrodeposition

Abstract

In this dissertation, a novel micro-pattern metallization technique which works via jet-circulating electrodeposition is proposed. The metallization process consists of three steps: electron beam evaporation, jet-circulating electrodeposition, and chemical etching. A copper seed layer for electrodeposition was formed on various materials by electron beam evaporation. Jet-circulating electrodeposition was implemented to fabricate micro-metal patterns on various surfaces, such as glass, plastic and ceramic surfaces. By localizing the circulation of a jetted electrolyte through two concentric nozzles, rapid selective electrodeposition could be performed. A copper pattern with a width of 490 μm and a height of 18.3 μm was fabricated with a 290 μm electrode nozzle. The conventional electrodeposition technique was applied to jet-circulating electrodeposition to increase deposition quality. Jet electrodeposition technique is applied to increases deposition rate. Pulse-reverse electrodeposition technique also increases deposition rate and decreases surface roughness. Furthermore diverse pulse parameter gives high flexibility to deposition process. The geometry of the copper pattern was investigated by means of scanning electron microscopy (SEM) and with a surface profiler. Finally, micro-pattern metallization using jet-circulating electrodeposition was performed on diverse substrate materials.