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Diffusion barriers for copper metallization :

DC Field Value Language
dc.contributor.advisor김기범-
dc.contributor.author김수현-
dc.date.accessioned2009-11-18T03:08:59Z-
dc.date.available2009-11-18T03:08:59Z-
dc.date.copyright2003.-
dc.date.issued2003-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000058622eng
dc.identifier.urihttps://hdl.handle.net/10371/12819-
dc.descriptionThesis (doctoral)--서울대학교 대학원 :재료공학부,2003.eng
dc.format.extentxvii, 148 p.eng
dc.language.isoeneng
dc.publisher서울대학교 대학원eng
dc.subject구리 배선공정eng
dc.subjectCopper metallizationeng
dc.subject확산방지막eng
dc.subjectDiffusion barriereng
dc.subject미세구조eng
dc.subjectMicrostructureeng
dc.subject화학기상증착eng
dc.subjectChemical vapor deposition (cvd)eng
dc.subjectTaNeng
dc.subjectTaneng
dc.subject이온빔 충격eng
dc.subjectIon beam bombardmenteng
dc.subjectTiNeng
dc.subjectTineng
dc.subjectAleng
dc.subjectAleng
dc.subject충진효과eng
dc.subjectMetal-interlayereng
dc.subject투과전자현미경eng
dc.subjectStuffingeng
dc.subject주사투과전자현미경eng
dc.subjectTransmission electron microscopy (tem)eng
dc.subject에너지 분산 분광법eng
dc.subjectScanning transmission electron microscopy (stem)eng
dc.subjectEnergy dispersive spectroscopy (eds)eng
dc.titleDiffusion barriers for copper metallization :eng
dc.titleimprovement of barrier performance against copper diffusion through controlling the microstructure of diffusion barrier 구리 배선공정을 위한 확산방지막에 관한 연구 : 확산방지막의 미세구조를 개선을 통한 구리에 대한 확산방지막 성능의 향상eng
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeDoctoreng
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