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Diffusion barriers for copper metallization :
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- Authors
- Advisor
- 김기범
- Issue Date
- 2003
- Publisher
- 서울대학교 대학원
- Keywords
- 구리 배선공정 ; Copper metallization ; 확산방지막 ; Diffusion barrier ; 미세구조 ; Microstructure ; 화학기상증착 ; Chemical vapor deposition (cvd) ; TaN ; Tan ; 이온빔 충격 ; Ion beam bombardment ; TiN ; Tin ; Al ; Al ; 충진효과 ; Metal-interlayer ; 투과전자현미경 ; Stuffing ; 주사투과전자현미경 ; Transmission electron microscopy (tem) ; 에너지 분산 분광법 ; Scanning transmission electron microscopy (stem) ; Energy dispersive spectroscopy (eds)
- Description
- Thesis (doctoral)--서울대학교 대학원 :재료공학부,2003.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000058622
https://hdl.handle.net/10371/12819
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