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Superfilling and leveling in damascene Cu electrodeposition for high performance semiconductor devices : 고성능 소자용 구리 전해 도금에서의 수퍼필링 및 레벨링
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- Authors
- Advisor
- 김재정
- Issue Date
- 2009
- Publisher
- 서울대학교 대학원
- Keywords
- 구리 ; Cu ; 반도체 배선 ; interconnection ; 구리 전해 도금 ; Cu electrodeposition ; 유기 첨가제 ; organic additive ; 수퍼필링 ; superfilling ; 레벨링 ; leveling ; 씨앗층 회복 ; seed layer repairing
- Description
- Thesis(doctors) --서울대학교 대학원 :화학생물공학부, 2009.2.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000036100
https://hdl.handle.net/10371/12974
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