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Reliability issues for high performance Cu interconnects : : 고성능구리배선 공정을 위한 신뢰성에 관한 연구 :
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- Authors
- Advisor
- 김기범
- Issue Date
- 2007
- Publisher
- 서울대학교 대학원
- Keywords
- 구리배선공정 ; copper metallization ; 구리 확산 ; copper migration ; 확산방지막 ; Cu diffusion ; 원자층증착법 ; diffusion barrier ; 다공성 저유전율 유전재료 ; atomic layer deposition (ALD) ; WNxCy ; low-k dielectric ; SiOCH ; nucleation and growth ; initial transient region of ALD ; plasma treatment ; pore sealing ; Cu ; SiO2 ; WNxCy ; SiOCH ; capacitance-voltage (C-V) measurement ; transmission electron microscopy (TEM) ; barrier performance
- Description
- 학위논문(박사)--서울대학교 대학원 :재료공학부,2007.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000042907
https://hdl.handle.net/10371/13516
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