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Copper-migration-induced dielectric breakdown in inter-layer dielectric : 층간 유전막에서의 구리 확상에 의한 유전막 파괴에 관한 연구
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- Authors
- Advisor
- 주영창
- Issue Date
- 2007
- Publisher
- 서울대학교 대학원
- Keywords
- 구리확산. 저유전물질. 유전막파괴 ; Cu-migration ; TDDB ; low-k dielectrics ; VRDB ; dielectric breakdown ; 누설전류 ; TDDB ; 전자이동기작 ; VRDB ; 기공 ; leakage currents ; 기공연결 ; electron conduction mechanism ; porosity ; pore interconnection
- Description
- 학위논문(박사) --서울대학교 대학원 :재료공학부,2007.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000042923
https://hdl.handle.net/10371/13594
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