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차세대 반도체 배선용 Cu(Mg) 박막의 미세구조와 전기적 특성 및 알루미늄 배선의 응력 평가
Microstructural and electrical properties of Cu(Mg) thin films and stress evaluation of aluminum lines for ULSI interconnects

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Authors
김병희
Advisor
주영창
Issue Date
2005
Publisher
서울대학교 대학원
Keywords
구리Cu(Mg)알루미늄MgO스트레스Reliability신뢰성TDDBAlStress induced voiding
Description
학위논문(석사)--서울대학교 대학원 :재료공학부,2005.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000051033

https://hdl.handle.net/10371/14323
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Master's Degree_재료공학부)
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