Publications
Detailed Information
3차원 전위 동역학을 이용한 copper via의 열피로 현상 해석 : (A)Study on thermal fatigue behavior in copper via using 3D discrete dislocation dynamics
Cited 0 time in
Web of Science
Cited 0 time in Scopus
- Authors
- Advisor
- 오규환
- Issue Date
- 2007
- Publisher
- 서울대학교 대학원
- Keywords
- copper via ; copper via ; 전위동역학 ; 3D Discrete Dislocation Dynamics ; 열피로
- Description
- 학위논문(석사)--서울대학교 대학원 :재료공학부,2007.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000045719
https://hdl.handle.net/10371/14843
- Files in This Item:
- There are no files associated with this item.
Item View & Download Count
Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.