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An analytical model of strain isolation for stretchable and flexible electronics
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cheng, H. | - |
dc.contributor.author | Wu, J. | - |
dc.contributor.author | Li, M. | - |
dc.contributor.author | Kim, D. -H. | - |
dc.contributor.author | Kim, Y. -S. | - |
dc.contributor.author | Huang, Y. | - |
dc.contributor.author | Kang, Z. | - |
dc.contributor.author | Hwang, K. C. | - |
dc.contributor.author | Rogers, J. A. | - |
dc.date.accessioned | 2020-02-17T04:21:48Z | - |
dc.date.available | 2020-02-17T04:21:48Z | - |
dc.date.created | 2018-06-29 | - |
dc.date.issued | 2011-02 | - |
dc.identifier.citation | Applied Physics Letters, Vol.98 No.6, p. 061902 | - |
dc.identifier.issn | 0003-6951 | - |
dc.identifier.other | 38401 | - |
dc.identifier.uri | https://hdl.handle.net/10371/164287 | - |
dc.description.abstract | One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length. (C) 2011 American Institute of Physics. [doi:10.1063/1.3553020] | - |
dc.language | 영어 | - |
dc.publisher | American Institute of Physics | - |
dc.title | An analytical model of strain isolation for stretchable and flexible electronics | - |
dc.type | Article | - |
dc.identifier.doi | 10.1063/1.3553020 | - |
dc.citation.journaltitle | Applied Physics Letters | - |
dc.identifier.wosid | 000287242100017 | - |
dc.identifier.scopusid | 2-s2.0-79951807418 | - |
dc.citation.number | 6 | - |
dc.citation.startpage | 061902 | - |
dc.citation.volume | 98 | - |
dc.identifier.sci | 000287242100017 | - |
dc.description.isOpenAccess | N | - |
dc.contributor.affiliatedAuthor | Kim, D. -H. | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.subject.keywordPlus | HIGH-PERFORMANCE ELECTRONICS | - |
dc.subject.keywordPlus | COMPLIANT SUBSTRATE | - |
dc.subject.keywordPlus | SPHERICAL DOMES | - |
dc.subject.keywordPlus | FILM | - |
dc.subject.keywordPlus | CIRCUITS | - |
dc.subject.keywordPlus | SILICON | - |
dc.subject.keywordPlus | TFTS | - |
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