Browse

Reduction of large particles in ceria slurry by aging and selective sedimentation and its effect on shallow trench isolation chemical mechanical planarization

Cited 8 time in Web of Science Cited 11 time in Scopus
Authors
Kim, Dae-Hyeong; Kang, Hyun-Goo; Kim, Sang-Kyun; Paik, Ungyu; Park, Jea-Gun
Issue Date
2006-09
Citation
Japanese Journal of Applied Physics, Vol.45 No.9A, pp.6790-6794
Keywords
agingselective sedimentationlarge particleceriaSTI-CMPdefect
Abstract
The effect of aging and selective sedimentation of ceria slurry on the slurry characteristics, such as the particle size distribution, the large-particle count, and the dispersion stability, and on the number of defects on the wafer surface during the shallow trench isolation (STI) chemical mechanical planarization (CMP) process was investigated. The aging time and temperature were considered as important variables giving great influence on the slurry characteristics and STI-CMP. By applying aging and selective sedimentation, the number of large particles produced by either strong agglomeration or soft flocculation in ceria slurry was successfully reduced, and the dispersion stability of the ceria particles was also improved. A CMP evaluation demonstrated that the number of defects on the wafer surface was significantly reduced, while maintaining the reasonable oxide removal rate and oxide-nitride selectivity.
ISSN
0021-4922
URI
http://hdl.handle.net/10371/164292
DOI
https://doi.org/10.1143/JJAP.45.6790
Files in This Item:
There are no files associated with this item.
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Chemical Convergence for Energy and Environment (에너지환경 화학융합기술전공)Journal Papers (저널논문_에너지환경 화학융합기술전공)
  • mendeley

Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.

Browse