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Dependence of non-Prestonian behavior of ceria slurry with anionic surfactant on abrasive concentration and size in shallow trench isolation chemical mechanical polishing

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dc.contributor.authorKang, Hyun-Goo-
dc.contributor.authorKim, Dae-Hyeong-
dc.contributor.authorKatoh, Takeo-
dc.contributor.authorKim, Sung-Jun-
dc.contributor.authorPaik, Ungyu-
dc.contributor.authorPark, Jea-Gun-
dc.date.accessioned2020-02-17T04:23:03Z-
dc.date.available2020-02-17T04:23:03Z-
dc.date.created2018-06-29-
dc.date.created2018-06-29-
dc.date.issued2006-05-
dc.identifier.citationJapanese Journal of Applied Physics, Vol.45 No.5A, pp.3896-3904-
dc.identifier.issn0021-4922-
dc.identifier.other38368-
dc.identifier.urihttps://hdl.handle.net/10371/164294-
dc.description.abstractThe dependencies of the non-Prestonian behavior of ceria slurry with anionic surfactant on the size and concentration of abrasive particles were investigated by performing chemical mechanical polishing (CMP) experiments using blanket wafers. We found that not only the abrasive size but also the abrasive concentration with s.urfactant addition influences the non-Prestonian behavior. Such behavior is clearly exhibited with small abrasive sizes and a higher concentrations of abrasives with surfactant addition, because the abrasive particles can locally contact the film surface more effectively with applied pressure. We introduce a factor to quantify these relations with the non-Prestonian behavior of a slurry. For ceria slurry, this non-Prestonian factor, beta(NP), was determined to be almost independent of the abrasive concentration for a larger size and a smaller weight conentration of abrasive particles, but it increased with the surfactant concentration for a smaller size and a higher concentration of abrasives with surfactant addition.-
dc.language영어-
dc.publisherInstitute of Pure and Applied Physics-
dc.titleDependence of non-Prestonian behavior of ceria slurry with anionic surfactant on abrasive concentration and size in shallow trench isolation chemical mechanical polishing-
dc.typeArticle-
dc.identifier.doi10.1143/JJAP.45.3896-
dc.citation.journaltitleJapanese Journal of Applied Physics-
dc.identifier.wosid000237713700014-
dc.identifier.scopusid2-s2.0-33646883051-
dc.citation.endpage3904-
dc.citation.number5A-
dc.citation.startpage3896-
dc.citation.volume45-
dc.identifier.sci000237713700014-
dc.description.isOpenAccessN-
dc.contributor.affiliatedAuthorKim, Dae-Hyeong-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.subject.keywordPlusNANOTOPOGRAPHY IMPACT-
dc.subject.keywordPlusMOLECULAR-WEIGHT-
dc.subject.keywordPlusREMOVAL RATE-
dc.subject.keywordPlusSTI-CMP-
dc.subject.keywordPlusPLANARIZATION-
dc.subject.keywordPlusPARTICLES-
dc.subject.keywordPlusOXIDE-
dc.subject.keywordAuthorCMP-
dc.subject.keywordAuthorshallow trench isolation-
dc.subject.keywordAuthorceria-
dc.subject.keywordAuthoroxide film-
dc.subject.keywordAuthornitride film-
dc.subject.keywordAuthorsurfactant concentration-
dc.subject.keywordAuthornon-Prestonian-
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  • College of Engineering
  • School of Chemical and Biological Engineering
Research Area Materials Science

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