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Agglomerated large particles under various slurry preparation conditions and their influence on shallow trench isolation chemical mechanical polishing

Cited 6 time in Web of Science Cited 6 time in Scopus
Authors
Kim, Dae-Hyeong; Kang, Hyun-Goo; Kim, Sang-Kyun; Paik, Ungyu; Park, Jea-Gun
Issue Date
2005-11
Citation
Japanese Journal of Applied Physics, Vol.44 No.11, pp.7770-7776
Keywords
agglomerationlarge particleceriaSTI CMPmicro-scratch
Abstract
The effects of various slurry manufacturing conditions, such as suspension pH, abrasive contents, and the calcination temperature of abrasive ceramic particles on the formation of agglomerated large particles of ceria slurry were investigated. The agglomerated large particles in slurry have much influence on the micro-scratches on the wafer surface in shallow trench isolation chemical mechanical polishing (STI CMP). The formation of large agglomerated particles is affected by the conformation of the organic additives in the slurry as a function of the suspension pH and the specific surface area of the abrasive particle. Regarding the solid content, abrasive particles are more easily dispersed at lower solid loading, which prevents additional agglomeration even under acidic conditions. The influence of agglomerated large particles on STI CMP was investigated through a polishing experiment with plasma-enhanced tetra-ethyl-ortho-silicate (PETEOS) and a low-pressure chemical vapor deposition (LPCVD) nitride layer.
ISSN
0021-4922
URI
http://hdl.handle.net/10371/164296
DOI
https://doi.org/10.1143/JJAP.44.7770
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Chemical Convergence for Energy and Environment (에너지환경 화학융합기술전공)Journal Papers (저널논문_에너지환경 화학융합기술전공)
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