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ULSI용 구리배선에서의 도금공정 및 결정성에 대한 연구
(A)Study on the electroplating process and crystallographic characteristics for copper interconnect

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Authors
이효종
Advisor
이동녕
Issue Date
2003
Publisher
서울대학교 대학원
Keywords
구리Copper도금Electroplating직접회로ULSI상감공정EBSD전자후방산란회절Damascene
Description
학위논문(박사)--서울대학교 대학원 :재료공학부,2003.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000058980

https://hdl.handle.net/10371/16803
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Materials Science and Engineering (재료공학부)Theses (Ph.D. / Sc.D._재료공학부)
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