Publications

Detailed Information

Interconnected network of Ag and Cu in bioplastics for ultrahigh electromagnetic interference shielding efficiency with high thermal conductivity

Cited 20 time in Web of Science Cited 20 time in Scopus
Authors

Kim, Dohoon; Lee, Young Jin; Ahn, Kyung Hyun

Issue Date
2022-02
Publisher
Elsevier
Citation
Composites Communications, Vol.30, p. 101903
Abstract
Herein, we synthesize the silver (Ag)-copper (Cu) double layer via electroless plating of Cu using a thin Ag layer as a catalyst on the biodegradable polylactic acid (PLA). Then, we perform hot compression molding for fabricating PLA/Ag/Cu nanocomposites. We found out that the uniform thin Ag layer not only acts well as a catalyst for Cu deposition, but disperses Cu successfully to form a 3D Cu conductive network. And, Ag also enhances the oxidation resistance of Cu. Thanks to the homogeneous interconnected Cu structure along Ag, the fabricated PLA/Ag/Cu nanocomposites exhibit an exceptional electromagnetic shielding efficiency (EMI SE) of 101.8 dB at 0.5 mm thickness and excellent in-plane (11.22 W/mK), through-plane (3.44 W/mK) thermal conductivity with only Ag (2.4 vol%) and Cu (6.3 vol%).
ISSN
2452-2139
URI
https://hdl.handle.net/10371/179297
DOI
https://doi.org/10.1016/j.coco.2022.101093
Files in This Item:
There are no files associated with this item.
Appears in Collections:

Altmetrics

Item View & Download Count

  • mendeley

Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.

Share