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180-GHz Broadside Radiation Bond-Wire Antenna for Short-Range Wireless Communication

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Bakshi, Harshpreet S.; Dong, Shenggang; Momson, Ibukunoluwa; Chacon, Diego; Chen, Zhe; Choi, Wooyeol; Blanchard, Andrew J.; Kenneth, K. O.

Issue Date
Institute of Electrical and Electronics Engineers Inc.
IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.11 No.3, pp.530-532
A technique for realizing an efficient broadside radiation bond-wire antenna for short-range wireless communication is demonstrated. The bond wire forming the antenna is located around 375 mu m (similar to lambda/4 at 180 GHz) above the ground plane on a printed circuit board (PCB) for constructive interference of reflected waves from the PCB and that radiated from the antenna. At 178.3 GHz, a gold bond wire shaped in a half loop and terminated on a bond pad of a neighboring chip 975-mu m away exhibits a measured peak gain of 2.5 dB at the phi = 90 degrees plane. The antenna also exhibits >20 GHz measured -10-dB vertical bar S-11 vertical bar bandwidth. The simulated efficiency is 52%.
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  • College of Engineering
  • Department of Electrical and Computer Engineering
Research Area High Frequency Microelectronics, Microwave engineering, Radio Frequency Integrated Circuit, 초고주파 공학, 초고주파 시스템, 초고주파 집적회로


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