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Low-Cost Packaging of 300 GHz Integrated Circuits With an On-Chip Patch Antenna (vol 18, pg 2444, 2019)

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dc.contributor.authorBakshi, Harshpreet S.-
dc.contributor.authorByreddy, Pranith R.-
dc.contributor.authorO, Kenneth K.-
dc.contributor.authorBlanchard, Andrew-
dc.contributor.authorLee, Mark-
dc.contributor.authorTuncer, Enis-
dc.contributor.authorChoi, Wooyeol-
dc.date.accessioned2024-04-30T01:21:00Z-
dc.date.available2024-04-30T01:21:00Z-
dc.date.created2024-04-26-
dc.date.created2024-04-26-
dc.date.issued2020-08-
dc.identifier.citationIEEE Antennas and Wireless Propagation Letters, Vol.19 No.8, pp.1466-1466-
dc.identifier.issn1536-1225-
dc.identifier.urihttps://hdl.handle.net/10371/199960-
dc.description.abstractPresents corrections to the above named paper.-
dc.language영어-
dc.publisherInstitute of Electrical and Electronics Engineers-
dc.titleLow-Cost Packaging of 300 GHz Integrated Circuits With an On-Chip Patch Antenna (vol 18, pg 2444, 2019)-
dc.typeArticle-
dc.identifier.doi10.1109/LAWP.2020.2999150-
dc.citation.journaltitleIEEE Antennas and Wireless Propagation Letters-
dc.identifier.wosid000557357800039-
dc.identifier.scopusid2-s2.0-85092276399-
dc.citation.endpage1466-
dc.citation.number8-
dc.citation.startpage1466-
dc.citation.volume19-
dc.description.isOpenAccessY-
dc.contributor.affiliatedAuthorChoi, Wooyeol-
dc.type.docTypeCorrection-
dc.description.journalClass1-
dc.subject.keywordAuthorPackaging-
dc.subject.keywordAuthorAntennas-
dc.subject.keywordAuthorSystem-on-chip-
dc.subject.keywordAuthorLoss measurement-
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  • College of Engineering
  • Department of Electrical and Computer Engineering
Research Area High Frequency Microelectronics, Microwave engineering, Radio Frequency Integrated Circuit, 초고주파 공학, 초고주파 시스템, 초고주파 집적회로

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