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Low-Cost Packaging of 300 GHz Integrated Circuits With an On-Chip Patch Antenna
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Bakshi, Harshpreet S. | - |
dc.contributor.author | Byreddy, Pranith R. | - |
dc.contributor.author | Kenneth, K. O. | - |
dc.contributor.author | Blanchard, A. | - |
dc.contributor.author | Lee, Mark | - |
dc.contributor.author | Tuncer, Enis | - |
dc.contributor.author | Choi, Wooyeol | - |
dc.date.accessioned | 2024-04-30T01:21:31Z | - |
dc.date.available | 2024-04-30T01:21:31Z | - |
dc.date.created | 2024-04-26 | - |
dc.date.created | 2024-04-26 | - |
dc.date.issued | 2019-11 | - |
dc.identifier.citation | IEEE Antennas and Wireless Propagation Letters, Vol.18 No.11, pp.2444-2448 | - |
dc.identifier.issn | 1536-1225 | - |
dc.identifier.uri | https://hdl.handle.net/10371/199970 | - |
dc.description.abstract | Placing a 300 GHz on-chip patch antenna in a low-cost quad-flat no-lead (QFN) package using materials based on silica microparticles dispersed in an epoxy matrix can improve the antenna performance. Full-wave simulations of a rectangular patch antenna, compliant with the metal stack and design rules of a 65 nm complementary metal-oxide-semiconductor (CMOS) process, show 13% radiation efficiency, 1 dB peak antenna gain, and 7 GHz -10 dB vertical bar S-11 vertical bar bandwidth increases when the thickness of packaging material over the antenna is similar to lambda/3. When placed in a QFN package, 276 GHz CMOS signal generators with the same on-chip antenna show the effective isotropic radiated power similar to 6 dB higher than that of unpackaged. This improvement is partly attributed to the antenna performance enhancement and demonstrates that it is possible to package 300 GHz integrated circuits with an on-chip patch antenna using a low-cost technique. | - |
dc.language | 영어 | - |
dc.publisher | Institute of Electrical and Electronics Engineers | - |
dc.title | Low-Cost Packaging of 300 GHz Integrated Circuits With an On-Chip Patch Antenna | - |
dc.type | Article | - |
dc.identifier.doi | 10.1109/LAWP.2019.2943371 | - |
dc.citation.journaltitle | IEEE Antennas and Wireless Propagation Letters | - |
dc.identifier.wosid | 000498569100021 | - |
dc.identifier.scopusid | 2-s2.0-85075010625 | - |
dc.citation.endpage | 2448 | - |
dc.citation.number | 11 | - |
dc.citation.startpage | 2444 | - |
dc.citation.volume | 18 | - |
dc.description.isOpenAccess | N | - |
dc.contributor.affiliatedAuthor | Choi, Wooyeol | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.subject.keywordPlus | HIGH-EFFICIENCY | - |
dc.subject.keywordPlus | CMOS | - |
dc.subject.keywordPlus | ARRAY | - |
dc.subject.keywordAuthor | Complementary metal-oxide-semiconductor (CMOS) | - |
dc.subject.keywordAuthor | low-cost quad-flat no-lead (QFN) | - |
dc.subject.keywordAuthor | millimeter-wave | - |
dc.subject.keywordAuthor | on-chip antenna | - |
dc.subject.keywordAuthor | packaging | - |
dc.subject.keywordAuthor | radiation efficiency | - |
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- Department of Electrical and Computer Engineering
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