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CMOS Transceiver Pixels for Terahertz Imaging

Cited 1 time in Web of Science Cited 1 time in Scopus
Authors

Choi, Wooyeol; Zhu, Yukun; Byreddy, Pranith R.; Chen, Zhiyu; Chen, Zhe; Newman, A. Jensen; Kenneth, K. O.

Issue Date
2019
Publisher
IEEE
Citation
2019 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT2019)
Abstract
Pixels integrating a transmitter and a coherent receiver in an area of half-wavelength square are proposed for terahertz active imaging. 300- and 427-GHz transceiver pixels are demonstrated using a 65-nm CMOS process. The 300-GHz pixel employs a push-push stacked cross-coupled VCO, which doubles as a transmitter and an LO, and a pair of diode-connected NMOS transistors for mixing. The pixel occupies an area of 450x580 mu m(2), and provides - 21.3-dBm total radiated power and -79.5-dBm sensitivity for a 1-kHz noise bandwidth at 260GHz. The 426-GHz pixel using a star-type triple- push Colpitts oscillator works as a transmitter and a self-oscillating mixer. The pixel occupies an area of 380x470 mu m(2). The radiated power is -17.9 dBm and the sensitivity is -89.6 dBm for a 1-kHz noise bandwidth. Link-budget analyses suggest that camera-like reflection-mode imaging of targets 5m away should be possible using the pixel and a 4.6cmx4.6cm reflector.
URI
https://hdl.handle.net/10371/199975
DOI
https://doi.org/10.1109/rfit.2019.8929129
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  • College of Engineering
  • Department of Electrical and Computer Engineering
Research Area High Frequency Microelectronics, Microwave engineering, Radio Frequency Integrated Circuit, 초고주파 공학, 초고주파 시스템, 초고주파 집적회로

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