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The flip-chip mounted MMIC technology using the modified MCM-D substrate for compact and low-cost W-band transceiver
Cited 3 time in
Web of Science
Cited 5 time in Scopus
- Authors
- Issue Date
- 2005
- Publisher
- IEEE
- Citation
- 2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4, Vol.2005, pp.1011-1014
- Abstract
- We present novel mufti-chip module (MCM)-D technology to improve the mechanical and thermal properties of a MCM-D substrate for a motherboard of the flip-chip structure. Advantages of the flip-chip mounted MMIC technology using the modified MCM-D substrate were investigated. Based on this investigation the W-band CPW MMIC amplifier using the 0.1-mu m GaAs pHEMT was successfully mounted on the modified MCNI-9 substrate by means of the flip-chip technology. Moreover, the W-band down-converter module with internal local oscillator (LO) source was realized with this technology.
- ISSN
- 0149-645X
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Related Researcher
- College of Engineering
- Department of Electrical and Computer Engineering
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