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3D network-on-chip with wireless links through inductive coupling
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, J. | - |
dc.contributor.author | Zhu, M. | - |
dc.contributor.author | Choi, K. | - |
dc.contributor.author | Ahn, J.H. | - |
dc.contributor.author | Sharma, R. | - |
dc.date.accessioned | 2024-05-02T06:23:23Z | - |
dc.date.available | 2024-05-02T06:23:23Z | - |
dc.date.created | 2024-04-23 | - |
dc.date.created | 2024-04-23 | - |
dc.date.issued | 2011 | - |
dc.identifier.citation | 2011 International SoC Design Conference, ISOCC 2011, pp.353-356 | - |
dc.identifier.issn | 0000-0000 | - |
dc.identifier.uri | https://hdl.handle.net/10371/200698 | - |
dc.description.abstract | Utilizing network-on-chips for manycore SoCs has already been studied widely, as traditional bus-based architectures are unlikely to endure so many inter-core communications. Since device scaling has come to a limit, the technology trend now is stacking dies three-dimensionally to obtain more silicon area and shorter wire length. The most challenging part for making a 3D chip is inter-layer communication method. Currently, TSV is the most popular and promising technique to provide the best performance. However, it suffers from many problems due to inter-layer wiring. As a substitute, inductive coupling can be used as a reliable and non-expensive technology. In this work, we use inductive coupling for the inter-layer communication to build a 3D NoC. We also propose a token bus protocol for an efficient implementation of multi-layer communications. Experimental results show that the proposed architecture achieves maximum throughput of 4.7 flits/cycle under uniform random traffic. ©2011 IEEE. | - |
dc.language | 영어 | - |
dc.publisher | ISOCC | - |
dc.title | 3D network-on-chip with wireless links through inductive coupling | - |
dc.type | Article | - |
dc.citation.journaltitle | 2011 International SoC Design Conference, ISOCC 2011 | - |
dc.identifier.scopusid | 2-s2.0-84863160858 | - |
dc.citation.endpage | 356 | - |
dc.citation.startpage | 353 | - |
dc.description.isOpenAccess | N | - |
dc.contributor.affiliatedAuthor | Lee, J. | - |
dc.contributor.affiliatedAuthor | Choi, K. | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.subject.keywordAuthor | 3D chip | - |
dc.subject.keywordAuthor | Inductive coupling | - |
dc.subject.keywordAuthor | NoC | - |
dc.subject.keywordAuthor | Wireless | - |
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- College of Engineering
- Department of Electrical and Computer Engineering
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