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A 0.5μV<sub>rms</sub> 12μW Patch Type Fabric Sensor for Wearable Body Sensor Network

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dc.contributor.authorYan, Long-
dc.contributor.authorYoo, Jerald-
dc.contributor.authorKim, Binhee-
dc.contributor.authorYoo, Hoi-Jun-
dc.date.accessioned2024-05-03T04:35:51Z-
dc.date.available2024-05-03T04:35:51Z-
dc.date.created2024-05-02-
dc.date.issued2009-
dc.identifier.citation2009 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC), pp.105-108-
dc.identifier.urihttps://hdl.handle.net/10371/200862-
dc.description.abstractA 0.5 mu V-rms, 12 mu W wirelessly powered patch type fabric sensor is presented for wearable body sensor network to continuously monitor personal bioelectric signals. Thick film electrodes are screen printed on the fabric with various metal components and their impedances of similar to 100k Omega are characterized. A 2-stage nested chopped analog readout front end (AFE) is optimized for the fabric sensor with reduced electrode referred noise performance of 0.5 mu V-rms. A 10b folded SAR ADC reduces capacitive DAC (CDAC) size and relaxes the power budget of ADC driver by 94%. The proposed fabric sensor operates with system resolution of 9b and CMRR>106dB. The chip fabricated with 0.18 mu m CMOS technology, the fabric sensor stacked by screen printed inductor (diameter=3cm and # turns=4) can measure the ECG and EMG signals with wirelessly transmitted power through inductive coupling.-
dc.language영어-
dc.publisherIEEE-
dc.titleA 0.5μVrms 12μW Patch Type Fabric Sensor for Wearable Body Sensor Network-
dc.typeArticle-
dc.identifier.doi10.1109/ASSCC.2009.5357190-
dc.citation.journaltitle2009 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC)-
dc.identifier.wosid000298194200027-
dc.identifier.scopusid2-s2.0-76249125433-
dc.citation.endpage108-
dc.citation.startpage105-
dc.description.isOpenAccessN-
dc.contributor.affiliatedAuthorYoo, Jerald-
dc.type.docTypeProceedings Paper-
dc.description.journalClass1-
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Yoo, Jerald유담
부교수
  • College of Engineering
  • Department of Electrical and Computer Engineering
Research Area Biomedical Applications, Energy-Efficient Integrated Circuits

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