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Packaging of SiC Power Module with a Low-Permittivity Material to Reduce Capacitive Coupling
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, Sihoon | - |
dc.contributor.author | Choi, Jiyoon | - |
dc.contributor.author | Shin, Jong-Won | - |
dc.contributor.author | Imaoka, Jun | - |
dc.contributor.author | Yamamoto, Masayoshi | - |
dc.date.accessioned | 2024-05-12T23:58:23Z | - |
dc.date.available | 2024-05-12T23:58:23Z | - |
dc.date.created | 2024-05-09 | - |
dc.date.issued | 2023 | - |
dc.identifier.citation | 2023 IEEE CPMT Symposium Japan, ICSJ 2023, pp.73-76 | - |
dc.identifier.uri | https://hdl.handle.net/10371/201440 | - |
dc.description.abstract | This study proposes a new power module configuration to reduce CM noise. The proposed module utilized a low permittivity material which replaces a part of bottom Cu layer. The design scheme does not sacrifice thermal performance and the size of power module remains the same. The power module does not experience a reduction in break-down voltage by the proposed design. The parasitic CM capacitance is reduced by 42% compared to that of the conventional module. Detailed explanations about packaging method for the proposed power module are also presented. | - |
dc.language | 영어 | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | Packaging of SiC Power Module with a Low-Permittivity Material to Reduce Capacitive Coupling | - |
dc.type | Article | - |
dc.identifier.doi | 10.1109/ICSJ59341.2023.10339578 | - |
dc.citation.journaltitle | 2023 IEEE CPMT Symposium Japan, ICSJ 2023 | - |
dc.identifier.scopusid | 2-s2.0-85182029094 | - |
dc.citation.endpage | 76 | - |
dc.citation.startpage | 73 | - |
dc.description.isOpenAccess | N | - |
dc.contributor.affiliatedAuthor | Shin, Jong-Won | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.subject.keywordAuthor | capacitive coupling | - |
dc.subject.keywordAuthor | common-mode capacitance | - |
dc.subject.keywordAuthor | common-mode noise | - |
dc.subject.keywordAuthor | low-permittivity material | - |
dc.subject.keywordAuthor | SiC power module | - |
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- College of Engineering
- Department of Electrical and Computer Engineering
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