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Packaging of SiC Power Module with a Low-Permittivity Material to Reduce Capacitive Coupling

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dc.contributor.authorChoi, Sihoon-
dc.contributor.authorChoi, Jiyoon-
dc.contributor.authorShin, Jong-Won-
dc.contributor.authorImaoka, Jun-
dc.contributor.authorYamamoto, Masayoshi-
dc.date.accessioned2024-05-12T23:58:23Z-
dc.date.available2024-05-12T23:58:23Z-
dc.date.created2024-05-09-
dc.date.issued2023-
dc.identifier.citation2023 IEEE CPMT Symposium Japan, ICSJ 2023, pp.73-76-
dc.identifier.urihttps://hdl.handle.net/10371/201440-
dc.description.abstractThis study proposes a new power module configuration to reduce CM noise. The proposed module utilized a low permittivity material which replaces a part of bottom Cu layer. The design scheme does not sacrifice thermal performance and the size of power module remains the same. The power module does not experience a reduction in break-down voltage by the proposed design. The parasitic CM capacitance is reduced by 42% compared to that of the conventional module. Detailed explanations about packaging method for the proposed power module are also presented.-
dc.language영어-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titlePackaging of SiC Power Module with a Low-Permittivity Material to Reduce Capacitive Coupling-
dc.typeArticle-
dc.identifier.doi10.1109/ICSJ59341.2023.10339578-
dc.citation.journaltitle2023 IEEE CPMT Symposium Japan, ICSJ 2023-
dc.identifier.scopusid2-s2.0-85182029094-
dc.citation.endpage76-
dc.citation.startpage73-
dc.description.isOpenAccessN-
dc.contributor.affiliatedAuthorShin, Jong-Won-
dc.type.docTypeConference Paper-
dc.description.journalClass1-
dc.subject.keywordAuthorcapacitive coupling-
dc.subject.keywordAuthorcommon-mode capacitance-
dc.subject.keywordAuthorcommon-mode noise-
dc.subject.keywordAuthorlow-permittivity material-
dc.subject.keywordAuthorSiC power module-
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  • College of Engineering
  • Department of Electrical and Computer Engineering
Research Area DC-DC and AC-DC power conversion, DC-DC 및 AC-DC 전력변환, converter modeling, high-density, high-frequency power conversion, 고밀도 고주파 전력 변환, 컨버터 모델링

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