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Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications

Cited 7 time in Web of Science Cited 8 time in Scopus
Authors

Dede, Ercan M.; Liu, Yanghe; Joshi, Shailesh N.; Zhou, Feng; Lohan, Danny J.; Shin, Jong-Won

Issue Date
2019-04
Publisher
ASME
Citation
JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS, Vol.11 No.2
Abstract
Design optimization of a three-dimensional (3D) heat flow structure for power electronics gate drive circuit thermal management is described. Optimization methods are described in the creation of several structural concepts targeted toward simultaneous temperature reduction of multiple gate drive integrated circuit (IC) devices. Each heat flow path concept is intended for seamless integration based on power electronics packaging space constraints, while maintaining required electrical isolation. The design synthesis and fabrication of a select concept prototype is presented along with the development of an experimental test bench for thermal performance characterization. Experimental results indicate a significant 45 degrees C maximum temperature reduction for the gate drive IC devices in a laboratory environment, which translates to an estimated 41 degrees C maximum temperature reduction under high temperature (similar to 100 degrees C) ambient conditions. The technical approach and design strategy are applicable to future wide band-gap (WBG) electronics packaging applications, where enhanced 3D thermal routing is expected to be critical to maximizing volumetric power density.
ISSN
1948-5085
URI
https://hdl.handle.net/10371/201448
DOI
https://doi.org/10.1115/1.4041440
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  • College of Engineering
  • Department of Electrical and Computer Engineering
Research Area DC-DC and AC-DC power conversion, DC-DC 및 AC-DC 전력변환, converter modeling, high-density, high-frequency power conversion, 고밀도 고주파 전력 변환, 컨버터 모델링

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