DBC switch module for management of temperature and noise in 220-W/in3 power assembly

Abstract

A switch module integrates semiconductor dies on a direct-bond-copper (DBC) substrate to achieve both noise robustness and low thermal resistance. Negative couplings between conductors as well as compact layout with 2.89-nH common-source inductance in the module eliminate self-turn-on from 420-A/mu s di/dt. The low thermal resistance of the DBC substrate provides 2.35-degrees C/W thermal resistance from junction to heat sink and limits the temperature rise of semiconductors switches to 50 degrees C. The maximum rated power and system density of the DBC and PCB modules are provided for 400-V application. A 2-kW dc-dc boost converter switched between 400 kHz and 1 MHz achieved a power density of 220 W/in(3) and an efficiency of 98.4% by employing the switch module.