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Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics

Cited 42 time in Web of Science Cited 48 time in Scopus
Authors

Wie, Dae Seung; Zhang, Yue; Kim, Min Ku; Kim, Bongjoong; Park, Sangwook; Kim, Young-Joon; Irazoqui, Pedro P.; Zheng, Xiaolin; Xu, Baoxing; Lee, Chi Hwan

Issue Date
2018-07
Publisher
National Academy of Sciences
Citation
Proceedings of the National Academy of Sciences of the United States of America, Vol.115 No.31, pp.E7236-E7244
Abstract
Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.
ISSN
0027-8424
URI
https://hdl.handle.net/10371/202174
DOI
https://doi.org/10.1073/pnas.1806640115
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  • College of Engineering
  • Department of Mechanical Engineering
Research Area Clean Hydrogen Production and Storage, Greenhouse Gas Reduction and Carbon Utilization, Water & Air Purification, 오염수 및 대기 정화 기술, 온실 기체 절감 및 탄소 자원화, 친환경 수소 생산 및 저장

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