S-Space College of Engineering/Engineering Practice School (공과대학/대학원) Dept. of Materials Science and Engineering (재료공학부) Theses (Master's Degree_재료공학부)
Study on the fabrication of flip chip lead-free solder bump by electroplating : 전해도금에 의한 플립칩 무연 솔더 범프 제작에 관한 연구
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- 서울대학교 대학원
- Thesis (master`s)--서울대학교 대학원 :재료공학부,2002.
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