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College of Engineering/Engineering Practice School (공과대학/대학원)
Dept. of Materials Science and Engineering (재료공학부)
Theses (Master's Degree_재료공학부)
Study on the fabrication of flip chip lead-free solder bump by electroplating : 전해도금에 의한 플립칩 무연 솔더 범프 제작에 관한 연구
- Authors
- Advisor
- 강춘식
- Issue Date
- 2002
- Publisher
- 서울대학교 대학원
- Description
- Thesis (master`s)--서울대학교 대학원 :재료공학부,2002.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000061997
https://hdl.handle.net/10371/30333
- Files in This Item: There are no files associated with this item.
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