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College of Engineering/Engineering Practice School (공과대학/대학원)
Dept. of Materials Science and Engineering (재료공학부)
Theses (Master's Degree_재료공학부)
레이저 간섭계(ESPI)를 통한 플립칩 패키지의 열변형 평가
- Authors
- Advisor
- 권동일
- Issue Date
- 2002
- Publisher
- 서울대학교 대학원
- Description
- 학위논문(석사)--서울대학교 대학원 :재료공학부,2002.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000061450
https://hdl.handle.net/10371/30358
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