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A study on the diffusion barrier property of titanium nitride (TiN) thin film for Cu metallization : Cu 배선공정을 위한 TiN 박막의 확산 방지막 특성에 관한 연구
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- Authors
- Advisor
- 김기범
- Issue Date
- 1999
- Publisher
- 서울대학교 대학원
- Description
- Thesis (master`s)--서울대학교 대학원 :금속공학과,1999.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000072890
https://hdl.handle.net/10371/30672
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