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A study on the diffusion barrier property of titanium nitride (TiN) thin film for Cu metallization
Cu 배선공정을 위한 TiN 박막의 확산 방지막 특성에 관한 연구

DC Field Value Language
dc.contributor.advisor김기범-
dc.contributor.author김수현-
dc.date.accessioned2010-01-15T02:46:06Z-
dc.date.available2010-01-15T02:46:06Z-
dc.date.copyright1999.-
dc.date.issued1999-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000072890eng
dc.identifier.urihttp://hdl.handle.net/10371/30672-
dc.descriptionThesis (master`s)--서울대학교 대학원 :금속공학과,1999.en
dc.format.extentix, 82 p.en
dc.language.isoenen
dc.publisher서울대학교 대학원en
dc.titleA study on the diffusion barrier property of titanium nitride (TiN) thin film for Cu metallizationen
dc.title.alternativeCu 배선공정을 위한 TiN 박막의 확산 방지막 특성에 관한 연구-
dc.typeThesis-
dc.contributor.department금속공학과-
dc.description.degreeMasteren
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Master's Degree_재료공학부)
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