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A study on the diffusion barrier property of titanium nitride (TiN) thin film for Cu metallization : Cu 배선공정을 위한 TiN 박막의 확산 방지막 특성에 관한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 김기범 | - |
| dc.contributor.author | 김수현 | - |
| dc.date.accessioned | 2010-01-15T02:46:06Z | - |
| dc.date.available | 2010-01-15T02:46:06Z | - |
| dc.date.copyright | 1999. | - |
| dc.date.issued | 1999 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000072890 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/30672 | - |
| dc.description | Thesis (master`s)--서울대학교 대학원 :금속공학과,1999. | en |
| dc.format.extent | ix, 82 p. | en |
| dc.language.iso | en | en |
| dc.publisher | 서울대학교 대학원 | en |
| dc.title | A study on the diffusion barrier property of titanium nitride (TiN) thin film for Cu metallization | en |
| dc.title.alternative | Cu 배선공정을 위한 TiN 박막의 확산 방지막 특성에 관한 연구 | - |
| dc.type | Thesis | - |
| dc.contributor.department | 금속공학과 | - |
| dc.description.degree | Master | en |
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