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College of Engineering/Engineering Practice School (공과대학/대학원)
Dept. of Material Science and Engineering (재료공학부)
Theses (Ph.D. / Sc.D._재료공학부)
A Study on fluxless soldering of Pb-free flip chip package
무연솔더 플립칩 패키지의 무플럭스 솔더링에 관한 연구
- Authors
- 홍순민
- Advisor
- 강춘식
- Issue Date
- 2002
- Publisher
- 서울대학교 대학원
- Keywords
- Fild Chip; 플립칩; Fluxless Soldering; 무플럭스 솔더링; Pb-free Solder; 무연남재; UBM; 젖음성; Wettability; 납재범프
- Description
- Thesis (doctoral)--서울대학교 대학원 :재료공학부,2002.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000060784
http://hdl.handle.net/10371/35436
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