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전자패키징용 다이아몬드 웨이퍼의 대면적 합성에 미치는 잔류응력의 영향 해석
Investigations of residual stress effect on large area deposition of diamond thick films for electronic applications

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Authors
정증현
Advisor
권동일
Issue Date
2001
Publisher
서울대학교 대학원
Keywords
다이아몬드 웨이퍼Diamond water잔류응력residual stress응력기울기stress geadient크래킹crackingbowing
Description
학위논문(박사)--서울대학교 대학원 :재료공학부,2001.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000066367

https://hdl.handle.net/10371/35458
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Materials Science and Engineering (재료공학부)Theses (Ph.D. / Sc.D._재료공학부)
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