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전자패키징용 다이아몬드 웨이퍼의 대면적 합성에 미치는 잔류응력의 영향 해석 : Investigations of residual stress effect on large area deposition of diamond thick films for electronic applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 권동일 | - |
| dc.contributor.author | 정증현 | - |
| dc.date.accessioned | 2010-01-17T02:18:16Z | - |
| dc.date.available | 2010-01-17T02:18:16Z | - |
| dc.date.copyright | 2001. | - |
| dc.date.issued | 2001 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000066367 | kor |
| dc.identifier.uri | https://hdl.handle.net/10371/35458 | - |
| dc.description | 학위논문(박사)--서울대학교 대학원 :재료공학부,2001. | ko |
| dc.format.extent | xiii, 212 장 | ko |
| dc.language.iso | ko | ko |
| dc.publisher | 서울대학교 대학원 | ko |
| dc.subject | 다이아몬드 웨이퍼 | ko |
| dc.subject | Diamond water | ko |
| dc.subject | 잔류응력 | ko |
| dc.subject | residual stress | ko |
| dc.subject | 응력기울기 | ko |
| dc.subject | stress geadient | ko |
| dc.subject | 크래킹 | ko |
| dc.subject | cracking | ko |
| dc.subject | 휨 | ko |
| dc.subject | bowing | ko |
| dc.title | 전자패키징용 다이아몬드 웨이퍼의 대면적 합성에 미치는 잔류응력의 영향 해석 | ko |
| dc.title.alternative | Investigations of residual stress effect on large area deposition of diamond thick films for electronic applications | ko |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Doctor | ko |
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