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전자패키징용 다이아몬드 웨이퍼의 대면적 합성에 미치는 잔류응력의 영향 해석
Investigations of residual stress effect on large area deposition of diamond thick films for electronic applications

DC Field Value Language
dc.contributor.advisor권동일-
dc.contributor.author정증현-
dc.date.accessioned2010-01-17T02:18:16Z-
dc.date.available2010-01-17T02:18:16Z-
dc.date.copyright2001.-
dc.date.issued2001-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000066367kor
dc.identifier.urihttps://hdl.handle.net/10371/35458-
dc.description학위논문(박사)--서울대학교 대학원 :재료공학부,2001.ko
dc.format.extentxiii, 212 장ko
dc.language.isokoko
dc.publisher서울대학교 대학원ko
dc.subject다이아몬드 웨이퍼ko
dc.subjectDiamond waterko
dc.subject잔류응력ko
dc.subjectresidual stressko
dc.subject응력기울기ko
dc.subjectstress geadientko
dc.subject크래킹ko
dc.subjectcrackingko
dc.subjectko
dc.subjectbowingko
dc.title전자패키징용 다이아몬드 웨이퍼의 대면적 합성에 미치는 잔류응력의 영향 해석ko
dc.title.alternativeInvestigations of residual stress effect on large area deposition of diamond thick films for electronic applicationsko
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeDoctorko
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Materials Science and Engineering (재료공학부)Theses (Ph.D. / Sc.D._재료공학부)
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