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전자패키징용 다이아몬드 웨이퍼의 대면적 합성에 미치는 잔류응력의 영향 해석 : Investigations of residual stress effect on large area deposition of diamond thick films for electronic applications
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- Authors
- Advisor
- 권동일
- Issue Date
- 2001
- Publisher
- 서울대학교 대학원
- Keywords
- 다이아몬드 웨이퍼 ; Diamond water ; 잔류응력 ; residual stress ; 응력기울기 ; stress geadient ; 크래킹 ; cracking ; 휨 ; bowing
- Description
- 학위논문(박사)--서울대학교 대학원 :재료공학부,2001.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000066367
https://hdl.handle.net/10371/35458
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